Gelid Solutions TP-GP04-R-D heat sink compound Thermal pad
Product images are illustrative. The original product may vary, so please refer to the product specifications in the product description.
Price
€ 14.10The e-shop price may differ with shops price. Price valid while supplier stock lasts.
Points 
+14
Delivery time and options
-
4-6 days -
4-6 days -
4-6 days -
4-6 days -
4-6 days -
4-6 days
Product details
| Product code | TP-GP04-R-D |
| EAN | 4897025782921 |
Product description
The GP-Ultimate 120×20 is designed to provide a perfect thermal interface to transfer heat to heatsinks when installed on PCBs with height differences and uneven surfaces, such as DRAM ICs, VRM ICs, power MOSFETs, NVRAM ICs, and other high-temperature SMD components. Thanks to its enhanced multilayer matrix, superior material composition, and ultimate 15W/mK thermal conductivity, the GP-Ultimate 120×20 offers best-in-class performance. The GP-Ultimate 120×20 is non-electrically conductive, non-corrosive, non-curing, and non-toxic, and supports an extended operating temperature range of -60°C to 220°C. It features seamless application and has thermal pad dimensions of 120x20mm to best fit the enlarged surfaces of RAM memory modules, GPU and CPU VRM circuits, M.2 Type SSDs, and other densely packed electronic devices. Gelid Solutions TP-GP04-R-D. Type: Thermal pad, Density: 3.2 g/cm³. Width: 120 mm, Depth: 20 mm, Height: 2 mm. Quantity per pack: 1 pc(s)
