Gembird TG-G15-02 heat sink compound Thermal paste 4.63 W/m·K 24 g
Product images are illustrative. The original product may vary, so please refer to the product specifications in the product description.
Price
€ 25.37The e-shop price may differ with shops price. Price valid while supplier stock lasts.
Points 
+25
Delivery time and options
-
8-10 days -
8-10 days -
8-10 days -
8-10 days -
8-10 days
Product details
| Product code | TG-G15-02 |
| EAN | 8716309102698 |
Product description
Thermal silicone compound (grease) for heatsinks
Helps the heat dissipation from a CPU, chipset or processor to a heatsink
Excellent thermal impedance
Perfect stability - will not separate, run, migrate, or bleed
Non-capacitive or electrically conductiveGembird TG-G15-02. Type: Thermal paste, Thermal conductivity: 4.63 W/m·K, Density: 3.15 g/cm³. Width: 30 mm, Depth: 35 mm, Height: 30 mm. Quantity per pack: 400 pc(s), Package width: 30 mm, Package depth: 35 mm. Country of origin: China
